全定制载板设计是否需要 NRE 费用?
需要。我们会按项目范围核算一次性工程费用;若后续采购量达到约定目标,可按双方约定冲抵到后续硬件订单中。
We provide more than rugged hardware. We deliver a complete end-to-end framework. From collaborative design and BIOS configuration to compliance testing and blind drop-shipping, we handle deployment complexity so your team can stay focused on growth.

Coordinate engineering, production setup, compliance, and fulfillment through one service stack designed for industrial deployment programs.
Overcome standard hardware limits with custom I/O layouts, thermal simulations, and collaborative board design.
Lock down BIOS parameters and pre-load golden software images for exact batch consistency.
True white-labeling with industrial silkscreening and tailored premium packaging.
Accelerate market access with in-house EMC pre-screening and managed lab certification.
Cross-border blind drop-shipping and strategic buffer inventory for global logistics.
Secure development investments with locked BOMs, EOL warnings, and structured RMA.
把工程、验证和交付放在同一套执行系统里衡量,项目放大后也能保持可预期的推进节奏。
100% high-temp burn-in and functional validation tests.
Proven experience with EMC, CE, FCC, and regional regulatory bodies.
Supporting blind drop-ship to end-sites without middleman delays.
需要。我们会按项目范围核算一次性工程费用;若后续采购量达到约定目标,可按双方约定冲抵到后续硬件订单中。
轻量级的接口或结构调整通常为 3 到 4 周;涉及板级重构或较深的系统改动时,常见周期是 6 到 12 周。
建议提供 AI、PDF、EPS 或 SVG 等矢量文件;若涉及注册商标,还需要提供可用于印刷的授权确认。
每台设备出货时都会绑定唯一序列号。即使采用 blind drop-shipping 模式,我们也会根据该序列号和原始出货记录来判断质保状态。
Connect with our engineering team to evaluate implementation timelines and custom configurations.